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STTH512
Ultrafast recovery - 1200 V diode
Main product characteristics
A K
IF(AV) VRRM Tj VF (typ) trr (typ)
5A 1200 V 175 C 1.25 V 48 ns
A K
TO-220AC STTH512D
A K
TO-220FPAC STTH512FP
Features and benefits

K A NC
DPAK STTH512B
Ultrafast, soft recovery Very low conduction and switching losses High frequency and/or high pulsed current operation High reverse voltage capability High junction temperature Insulated package: TO-220FPAC Electrical insulation = 2000 VRMS Capacitance = 12 pF
Order codes
Part Number STTH512D STTH512B Marking STTH512D STTH512B STTH512B STTH512FP
Description
The high quality design of this diode has produced a device with low leakage current, regularly reproducible characteristics and intrinsic ruggedness. These characteristics make it ideal for heavy duty applications that demand long term reliability. Such demanding applications include industrial power supplies, motor control, and similar mission-critical systems that require rectification and freewheeling. These diodes also fit into auxiliary functions such as snubber, bootstrap, and demagnetization applications. The improved performance in low leakage current, and therefore thermal runaway guard band, is an immediate competitive advantage for this device.
STTH512B-TR STTH512FP
March 2006
Rev 1
www.st.com
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Characteristics
STTH512
1
Table 1.
Symbol VRRM IF(RMS)
Characteristics
Absolute ratings (limiting values at 25 C, unless otherwise specified)
Parameter Repetitive peak reverse voltage TO-220AC / TO-220FPAC RMS forward current DPAK Average forward current, = 0.5 Repetitive peak forward current Surge non repetitive forward current Storage temperature range Maximum operating junction temperature TO-220AC / DPAK TO-220FPAC Tc = 145 C Tc = 105 C 60 55 -65 to + 175 175 A A C C 10 5 A Value 1200 30 A Unit V
IF(AV) IFRM IFSM Tstg Tj
tp = 5 s, F = 5 kHz square tp = 10 ms Sinusoidal
Table 2.
Symbol Rth(j-c)
Thermal parameters
Parameter TO-220AC / DPAK Junction to case TO-220FPAC 5.8 Value 2.5 C/W Unit
Table 3.
Symbol IR(1)
Static electrical characteristics
Parameter Reverse leakage current Test conditions Tj = 25 C Tj = 125 C Tj = 25 C VR = VRRM Min. Typ Max. 5 A 3 30 2.2 IF = 5 A 1.30 1.25 2.0 1.9 V Unit
VF
(2)
Forward voltage drop
Tj = 125 C Tj = 150 C
1. Pulse test: tp = 5 ms, < 2 % 2. Pulse test: tp = 380 s, < 2 %
To evaluate the conduction losses use the following equation: P = 1.5 x IF(AV) + 0.08 IF2(RMS) Table 4.
Symbol
Dynamic characteristics
Parameter Test conditions IF = 1 A, dIF/dt = -50 A/s, VR = 30 V, Tj = 25 C IF = 1 A, dIF/dt = -100 A/s, VR = 30 V, Tj = 25 C Reverse recovery current IF = 5 A, dIF/dt = -200 A/s, VR = 600 V, Tj = 125 C 48 11 Min. Typ Max. 95 ns 70 16 A Unit
trr
Reverse recovery time
IRM
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STTH512 Table 4.
S tfr VFP
Characteristics Dynamic characteristics
Softness factor Forward recovery time Forward recovery voltage IF = 5 A, dIF/dt = -200 A/s, VR = 600 V, Tj = 125 C dIF/dt = 50 A/s IF = 5 A VFR = 1.5 x VFmax, Tj = 25 C IF = 5 A, dIF/dt = 50 A/s, Tj = 25 C 9.5 2 400 ns V
Figure 1.
P(W)
13 12 11 10 9 8 7 6 5 4 3 2 1 0 0.0 0.5 1.0
Conduction losses versus average current
= 0.1 = 0.05 =1 = 0.2 = 0.5
Figure 2.
IFM(A)
50 45 40 35 30 25 20 15
Forward voltage drop versus forward current
Tj=150C (typical values)
Tj=25C (maximum values) Tj=150C (maximum values)
T
10 5
IF(AV)(A)
1.5 2.0 2.5 3.0 3.5 4.0 4.5
=tp/T
5.0 5.5
tp
0 6.0 0.0 0.5 1.0 1.5 2.0
VFM(V)
2.5 3.0 3.5 4.0 4.5 5.0
Figure 3.
Relative variation of thermal impedance junction to case versus pulse duration
Figure 4.
Relative variation of thermal impedance junction to case versus pulse duration
Zth(j-c)/Rth(j-c)
1.0 0.9 0.8 0.7 0.6 0.5 0.4 0.3 0.2 0.1 0.0 1.E-03 1.E-02 1.E-01 1.E+00
Single pulse TO-220AC DPAK
Zth(j-c)/Rth(j-c)
1.0 0.9 0.8 0.7 0.6 0.5 0.4 0.3 0.2
Single pulse TO-220FPAC
tp(s)
0.1 0.0 1.E-03 1.E-02
tp(s)
1.E-01 1.E+00 1.E+01
Figure 5.
Peak reverse recovery current versus dIF/dt (typical values)
Figure 6.
Reverse recovery time versus dIF/dt (typical values)
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Characteristics
STTH512
IRM(A)
28 26 24 22 20 18 16 14 12 10 8 6 4 2 0 0 100 200 300 400 500
IF=0.5 x IF(AV) IF=IF(AV) VR=600V Tj=125C IF=2 x IF(AV)
trr(ns)
600 550 500 450 400 350 300 250 200 150 100
IF=2 x IF(AV) IF=IF(AV) IF=0.5 x IF(AV) VR=600V Tj=125C
dIF/dt(A/s)
50 0 0 100
dIF/dt(A/s)
200 300 400 500
Figure 7.
Qrr(nC)
2000 1800 1600 1400 1200 1000 800 600 400
VR=600V Tj=125C
Reverse recovery charges versus dIF/dt (typical values)
Figure 8.
S factor
4.0 3.5
Softness factor versus dIF/dt (typical values)
IF 2xIF(AV) VR=600V Tj=125C
IF=2 x IF(AV)
3.0 2.5 2.0 1.5 1.0
IF=IF(AV) IF=0.5 x IF(AV)
200 0 0 100
dIF/dt(A/s)
0.5 200 300 400 500 0 100
dIF/dt(A/s)
200 300 400 500
Figure 9.
Relative variations of dynamic parameters versus junction temperature
IF=IF(AV) VR=600V Reference: Tj=125C
S factor
Figure 10. Transient peak forward voltage versus dIF/dt (typical values)
VFP(V)
50 45 40 35 30 25
IF=IF(AV) Tj=125C
2.25 2.00 1.75 1.50 1.25 1.00 0.75 0.50 0.25 0.00 25 50 75 100 125
QRR trr IRM
20 15 10
Tj(C)
5 0 0 50 100
dIF/dt(A/s)
150 200 250 300
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STTH512
Characteristics
Figure 11. Forward recovery time versus dIF/dt (typical values)
tfr(ns)
700
IF=IF(AV) VFR=1.5 x VF max. Tj=125C
Figure 12. Junction capacitance versus reverse voltage applied (typical values)
C(pF)
100
F=1MHz VOSC=30mVRMS Tj=25C
600
500 10 400
300
dIF/dt(A/s)
200 0 50 100 150 200 250 300 350 400 450 500
VR(V)
1 1 10 100 1000
Figure 13. Thermal resistance junction to ambient versus copper surface under tab (Epoxy printed circuit board FR4, ecu = 35 m)
Rth(j-a)(C/W)
100 90 80 70 60 50 40 30 20 10 0 0 5 10 15 20 25 30 35 40
SCU(cm)
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Package mechanical data
STTH512
2
Package mechanical data
Epoxy meets UL94, V0 Cooling method: by conduction (C) Recommended torque value: 0.55 Nm (TO-220AC) Maximum torque value: 0.7 Nm (TO-220AC) Table 5. T0-220AC dimensions
DIMENSIONS REF. Millimeters Min.
H2 OI L5 L7 L6 L2 C A
Inches Min. 0.173 0.048 0.094 0.019 0.024 0.044 0.194 0.393 Max. 0.181 0.051 0.107 0.027 0.034 0.066 0.202 0.409
Max. 4.60 1.32 2.72 0.70 0.88 1.70 5.15 10.40
A C D E F F1 G
4.40 1.23 2.40 0.49 0.61 1.14 4.95 10.00
F1
L9 L4 F
D
H2 L2 L4
16.40 typ. 13.00 2.65 15.25 6.20 3.50 14.00 2.95 15.75 6.60 3.93
0.645 typ. 0.511 0.104 0.600 0.244 0.137 0.551 0.116 0.620 0.259 0.154
M E G
L5 L6 L7 L9 M Diam. I
2.6 typ. 3.75 3.85
0.102 typ. 0.147 0.151
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STTH512 Table 6. T0-220FPAC dimensions
Package mechanical data
DIMENSIONS REF Millimeters Min.
A H B
Inches Min. 0.173 0.098 0.098 0.018 0.030 0.045 0.195 0.094 0.393 Max. 0.181 0.106 0.108 0.027 0.039 0.067 0.205 0.106 0.409
Max. 4.6 2.7 2.75 0.70 1 1.70 5.20 2.7 10.4
A B D
4.4 2.5 2.5 0.45 0.75 1.15 4.95 2.4 10
Dia L6 L2 L3 L5 F1 L4 D L7
E F F1 G G1 H L2 L3
16 Typ. 28.6 9.8 2.9 15.9 9.00 3.00 30.6 10.6 3.6 16.4 9.30 3.20
0.63 Typ. 1.126 0.386 0.114 0.626 0.354 0.118 1.205 0.417 0.142 0.646 0.366 0.126
F G1 G
E
L4 L5 L6 L7 Dia.
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Package mechanical data Table 7. DPAK dimensions
DIMENSIONS REF. Millimeters Min.
E B2 L2 C2 A
STTH512
Inches Min. 0.086 0.035 0.001 0.025 0.204 0.017 0.018 0.236 0.251 0.173 0.368 Max. 0.094 0.043 0.009 0.035 0.212 0.023 0.023 0.244 0.259 0.181 0.397
Max 2.40 1.10 0.23 0.90 5.40 0.60 0.60 6.20 6.60 4.60 10.10
A A1 A2 B
D
2.20 0.90 0.03 0.64 5.20 0.45 0.48 6.00 6.40 4.40 9.35
H L4 B G A1
R
B2 C
R C
C2 D E
A2 0.60 MIN.
G H
V2
L2 L4 V2
0.80 typ. 0.60 0 1.00 8
0.031 typ. 0.023 0 0.039 8
Figure 14. DPAK footprint (dimensions in mm)
6.7
3
3
1.6
2.3 6.7 2.3
1.6
In order to meet environmental requirements, ST offers these devices in ECOPACK(R) packages. These packages have a Lead-free second level interconnect . The category of second level interconnect is marked on the package and on the inner box label, in compliance with JEDEC Standard JESD97. The maximum ratings related to soldering conditions are also marked on the inner box label. ECOPACK is an ST trademark. ECOPACK specifications are available at: www.st.com.
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STTH512
Ordering information
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Ordering information
Part Number STTH512D STTH512FP STTH512B STTH512B-TR Marking STTH512D STTH512FP STTH512B STTH512B Package TO-220AC TO-220FPAC DPAK DPAK Weight 1.86g 2.2 0.30 0.30 Base qty 50 50 75 2500 Delivery mode Tube Tube Tube Tape & reel
4
Revision history
Date 02-Mar-2006 Revision 1 First issue. Description of Changes
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STTH512
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